SEMICONDUCTOR WAFER MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer manufacturing method which enables transferring of a semiconductor wafer having been subject to patterning to a next process after grinding a rear face side of the semiconductor wafer with preventing warp and breakage of the semiconductor wafer.

SOLUTION: A semiconductor wafer manufacturing method comprises: attaching a pattern surface on a surface side of a semiconductor wafer 1 having been subject to patterning to a carrier plate 2; grinding a rear face 1b side of the semiconductor wafer 1 to a thickness of 50-120 μm; subsequently vacuum suctioning the rear face 1b side to detach the semiconductor wafer 1 from the carrier plate 2; attaching a surface protection sheet 6 to the pattern surface on the surface 1a side; subsequently, releasing vacuum suction on the rear face 1b side to invert the semiconductor wafer 1; and attaching a rear face protection sheet 7 to the rear face 1b side.

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