发明名称 SUBSTRATE INSPECTION METHOD AND DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To detect with high accuracy a defect of a mask substrate that is likely to warp greatly on a stage. <P>SOLUTION: By placing opposed two sides of a mask substrate on an inclined surface to be a substrate supporting part of inspection table means and spraying air jet flow on an undersurface of the mask substrate from air floating stage means, the mask substrate is not allowed to warp. Further, by spraying air jet flow from an upper surface side of the opposed two sides of the mask substrate and pushing an under side of the mask substrate against the inclined surface, the two sides of the mask substrate are caused to be held by air to the inspection table means in a fixed manner. Warp of the mask substrate is corrected by spraying air jet flow to the undersurface of the mask substrate, and therefore, a substrate inspection device can detect with high accuracy a defect of a nearly flat-shaped mask substrate in which warp has been corrected. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013044578(A) 申请公布日期 2013.03.04
申请号 JP20110181026 申请日期 2011.08.22
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 SHIMODA YUICHI;KINUGAWA KOHEI
分类号 G01N21/956;G03F1/84 主分类号 G01N21/956
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