发明名称 IC CHIP AND ARRANGEMENT METHOD OF IC CHIP
摘要 <P>PROBLEM TO BE SOLVED: To provide an IC chip, even if being installed in a concrete body, securing mechanical strength and safety of construction and surely achieving the durability of several decades unit with neither reducing an amount of concrete to be used nor being handled as a foreign substance, and an arrangement method thereof in the concrete. <P>SOLUTION: An IC chip 1 includes an IC chip body 2 that is covered with a covering material 2 having alkali resistance and water resistance. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013045286(A) 申请公布日期 2013.03.04
申请号 JP20110182658 申请日期 2011.08.24
申请人 SUMITOMO OSAKA CEMENT CO LTD 发明人 UEHARA NOBUO
分类号 G06K19/077;B28B23/00;G06K19/00;G06K19/07 主分类号 G06K19/077
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