| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heating apparatus and a method of manufacturing a semiconductor device that allow prevention of warpage of a wafer. <P>SOLUTION: There is provided a heating apparatus including a heater, a temperature detector, a wafer warpage detector, and a controller. The heater heats a wafer. The temperature detector detects the temperature of the wafer. The wafer warpage detector detects the warpage of the wafer. The controller controls the heater on the basis of the detection result of the wafer warpage detector before controlling the heater on the basis of the detection result of the temperature detector. <P>COPYRIGHT: (C)2013,JPO&INPIT |
