发明名称 IMPRINT MOLD, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide an imprint mold capable of forming a through hole with high accuracy. <P>SOLUTION: The imprint mold 10 is a meatl mold for heat imprinting constituted of, for example, silicon (Si). The imprint mold includes a supporting part 11, a projection 12 which is projected from the supporting part 11 and corresponds to a via hole, a lipophilic film 16 formed on a fore end surface 141 of the projection 12, and a release film 17 formed on all other surfaces than the fore end surface 141. The lipophilic film 16 is formed of, for example, hexamethyldisilazane (HMDS, C6H19NSi2), and octadecyl trichlorosilane (OTS, SiCl3C18H37). On the other hand, a fluorine monomolecular film can be illustrated as the release film 17. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013043415(A) 申请公布日期 2013.03.04
申请号 JP20110184363 申请日期 2011.08.26
申请人 FUJIKURA LTD 发明人 HIRANO HIROYUKI
分类号 B29C59/02;B29C33/58;H01L21/027;H05K3/00;H05K3/42 主分类号 B29C59/02
代理机构 代理人
主权项
地址