摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin from which a cured product exhibiting excellent working efficiency and having both of high glass transition temperature and high flame retardancy can be obtained, though it is a halogen-free substance. <P>SOLUTION: There are provided the epoxy resin shown by general formula (1), a method of producing the epoxy resin, an epoxy resin composition containing the epoxy resin, a semiconductor sealant comprising the epoxy resin composition, the cured product of the epoxy resin composition, and a semiconductor device containing the cured product. <P>COPYRIGHT: (C)2013,JPO&INPIT |