| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board in which a plating layer is well deposited on a surface metal layer and which achieves excellent reliability. <P>SOLUTION: A wiring board 10 of a present embodiment comprises: an insulating base 1; a heat dissipation member 2 containing CuW and provided in the insulating base 1 so as to be partially exposed on the insulating base 1; a first surface metal layer 3a containing Mo as a major ingredient and provided on a surface of the insulating base 1 so as to cover the heat dissipation member 2 in contact with the heat dissipation member 2 and having a surface containing Cu; a metal member 3c composed of CuW and provided on the surface of or inside the insulating base 1 in contact with the second surface metal layer 3b; and plating layers respectively provided on the first surface metal layer 3a and the second surface metal layer 3b. A metal layer can be deposited on each of the surfaces of the first surface metal layer 3a and the second surface metal layer 3b starting from Cu. <P>COPYRIGHT: (C)2013,JPO&INPIT |
