| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a vacuum sealing device which reduces the influences of heat generation of an IC chip which acts on a device chip. <P>SOLUTION: A vacuum sealing device includes: a device chip 100A; an IC chip 200A cooperating with the device chip 100A; and a package 300 where the device chip 100A and the IC chip 200A are housed being spaced apart from each other in the thickness direction of these chips. In the package 300, double-tiered recessed parts 301a, 301b are provided at one surface side of a package body 301. The IC chip 200A is joined to an inner bottom surface of the lower tier recessed part 301a through a second joining part 312, and the device chip 100A is hermetically joined to an entire periphery in a peripheral part of the lower tier recessed part 301a on an inner bottom surface of the upper tier recessed part 301b through a third joining part 313. In the vacuum sealing device, a first hermetic space 321, which is enclosed by the package body 301, the device chip 100A, the third joining part 313, and a package lid 302, has a vacuum atmosphere. <P>COPYRIGHT: (C)2013,JPO&INPIT |
