SEMICONDUCTOR DEVICE PACKAGING HAVING PRE-ENCAPSULATION THROUGH VIA FORMATION USING LEAD FRAMES WITH ATTACHED SIGNAL CONDUITS

摘要

A semiconductor device package having pre-formed and placed through vias and a process for making such a package is provided. One or more signal conduits are coupled to a lead frame that is subsequently embedded in an encapsulated semiconductor device package. The free end of signal conduits is exposed while the other end remains coupled to a lead frame. The signal conduits are then used as through package vias, providing signal-bearing pathways between interconnects or contacts on the bottom and top of the package and the leads.