LIGHT-EMITTING ELEMENT CHIP AND METHOD FOR MANUFACTURING SAME
摘要
<p>Provided is a light-emitting element chip in which assembly can be safely performed, and a method for manufacturing the light-emitting element chip. A light-emitting element chip (10) has a semiconductor layer (12) provided with a light-emitting layer (12a) on a support section (11). The support section (11) has a concave shape, serves as a support substrate in the light-emitting element chip (10), and is connected to one of the electrodes on the semiconductor layer (12). The outer peripheral section of the support section (11) (support-section outer peripheral section (11a)) surrounds the semiconductor layer (12), and protrudes further and is set in a position that is higher than an n-side electrode (15) and the other surface (12d) of the semiconductor layer (12).</p>
