| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat bonding material that eliminates the need of mask formation, causes few impurity residues, hardly causes a short circuit due to migration and has a high bonding strength. <P>SOLUTION: The heat bonding material includes 30-90 mass% of a metal fine particle (P) having a sintering property and 70-10 mass% of a dispersion medium (A) that is liquefied at 25°C, wherein 20-100 mass% of the dispersion medium (A) is liquid alcohol and/or polyalcohol (A1) at 25°C, while 80-0 mass% thereof is solid alcohol and/or polyalcohol (A2) at 25°C, the alcohol and/or the sum of the polyalcohol (A1) and (A2) are contained by 0.1 mass times or more of the content of the metal fine particle (P), and 80 mass% or more of the metal fine particle (P) is a metal fine particle (P1) with an average primary grain size of 5-200 nm. The heat bonding material has a viscosity of 200 Pa s or more that is measured at 25°C by a vibration type viscometer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
