| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a verification device and a verification method for infrared thermal image array module. <P>SOLUTION: The verification device and verification method for infrared thermal image array module mainly include thermal image module standard design, and epitaxial and optical property verification, and calibrate an epitaxial parameter. A single quick-close type sensing component manufacturing process and temperature-changing photoelectric quantity measurement verification are performed, and hereby the epitaxial completes low-temperature temperature change and transformation measurement calibration of a sensing component. A focal plane array manufacturing process and its photoelectric uniformity are verified, and a dark current uniformity test is conducted. Adhesion between a focal plane array and a signal readout integrated circuit, and verification of a polishing manufacturing process are carried out. Indium adhesion is performed between a sensing module and the signal readout integrated circuit, and thereby a photoelectric signal is converted. A thermal image quality integration test verification is performed, and optimum driving, control output parameter analysis and measurement are adjusted. A thermal image array module model is performed continuously, and bonding with the focal plane sensing array is performed by utilizing an indium colum bonding system to achieve completion of an image sensing array module model. <P>COPYRIGHT: (C)2013,JPO&INPIT |
