发明名称 |
INTERCONNECTION ELEMENTS WITH ENCASED INTERCONNECTS |
摘要 |
An interconnection element is disclosed that includes a plurality of drawn metal conductors, a dielectric layer, and opposed surfaces having a plurality of wettable contacts thereon. The conductors may include grains having lengths oriented in a direction between the first and second ends of the conductors. A dielectric layer for insulating the conductors may have first and second opposed surfaces and a thickness less than 1 millimeter between the first and second surface. One or more conductors may be configured to carry a signal to or from a microelectronic element. First and second wettable contacts may be used to bond the interconnection element to at least one of a microelectronic element and a circuit panel. The wettable contacts may match a spatial distribution of element contacts at a face of a microelectronic element or of circuit contacts exposed at a face of component other than the microelectronic element. |
申请公布号 |
US2013050972(A1) |
申请公布日期 |
2013.02.28 |
申请号 |
US201113215725 |
申请日期 |
2011.08.23 |
申请人 |
MOHAMMED ILYAS;HABA BELGACEM;TESSERA, INC. |
发明人 |
MOHAMMED ILYAS;HABA BELGACEM |
分类号 |
H05K7/04;H01B7/00;H01L21/50;H01R43/00 |
主分类号 |
H05K7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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