| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package laminate structure having an asymmetrical conductive constituent. <P>SOLUTION: A package laminate structure comprises: an upper package substrate 901c including a first side S1, a second side S2 opposed to the first side S1, a first region near the first side and a second region near the second side S2; an upper package 900c including a first upper semiconductor element arranged on the upper package substrate 901c; and a lower package having a lower package substrate 606c and a lower semiconductor element 650, the lower package being connected to the upper package via inter-package connection parts 990A, 990B. The inter-package connection parts 990A, 990B have a first inter-package connection part, a second inter-package connection part, a third inter-package connection part, and a fourth inter-package connection part. The first inter-package connection part and the second inter-package connection part are arranged in the first region, and the third inter-package connection part is arranged in the second region. <P>COPYRIGHT: (C)2013,JPO&INPIT |
