METHOD FOR CHEMICAL-MECHANICAL POLISHING TUNGSTEN

摘要

PROBLEM TO BE SOLVED: To provide new chemical-mechanical polishing compositions and methods for use as tungsten buff formulations for achieving better topography performance.

SOLUTION: The method comprises: providing a substrate containing tungsten; providing a chemical-mechanical polishing slurry composition, and a chemical-mechanical polishing pad which has a polishing surface; creating dynamic contact at an interface between the polishing surface of the chemical-mechanical polishing pad and the substrate with down force of 0.69 to 34.5 kPa; and dispensing the chemical-mechanical polishing slurry composition onto the chemical-mechanical polishing pad at or near the interface between the chemical-mechanical polishing pad and the substrate, where the substrate is polished, and some of the tungsten is removed from the substrate.

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