| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrochemical device which, even when a via conductor part is used for a lead-out conductor, can prevent a section where the via conductor part is provided from being broken by stress owing to thermal expansion/contraction accompanying temperature variation in reflow soldering, temperature variation after mounting, etc. <P>SOLUTION: A first lead-out conductor 50 has a via conductor part 52 along the thickness direction of a plate-like part 22 (upper layer 22a), and the via conductor part 52 is provided shifting in position from a center CT of the plate-like part 22. Namely, the via conductor part 52 is provided avoiding the center CT of the plate-like part 22 where stress generated owing to the thermal expansion/contraction accompanying the temperature variation in reflow soldering, temperature variation after mounting, etc. is apt to concentrate, so that even when stress generated owing to the thermal expansion/contraction is applied to the plate-like part 22, the risk that a section of the plate-like part 22 where the via conductor part 22 is provided is broken by the stress can surely be avoided. <P>COPYRIGHT: (C)2013,JPO&INPIT |
