| 摘要 |
Provided is a substrate with a built-in component, comprising: a first base body further comprising a first substrate which a first electronic component is built into and a first electrode which is exposed on a first face of the first substrate and is electrically connected to the first electronic component; a first bonding part which is disposed upon the first face of the first substrate; a second electronic component which is anchored upon the first face of the first substrate with the first bonding part interposed therebetween; a second base body further comprising a second substrate having an aperture in a location which a second electronic component is built into and a second electrode which is exposed on a first face of the second substrate; a second bonding part which is located between the first base body and the second base body and anchors a second face of the second substrate upon the first face of the first substrate; a third base body further comprising a third substrate and a third electrode which is exposed upon a first face of the third substrate; and a third bonding part which is located between the second base body and the third base body and anchors a second face of the third substrate upon the first surface of the second substrate. The first electrode, the second electrode, and the third electrode are electrically connected to the second electronic component. The second electronic component is covered in the periphery thereof by at least the first bonding part and the third bonding part. |
