| 摘要 |
An LED module A1 includes a first lead 1 with a mount surface 12a at a die-bonding portion 12, a second lead 2 with a wire-bonding portion 22 and having a thickness direction corresponding to that of the lead 1, and an LED chip 3 on the mount surface 12a, with a first electrode terminal 31 connected to the first lead 1, and a second electrode terminal 32 connected to the second lead 2. A support member 4 supports the leads 1, 2, The second terminal 32 is on a thickness-side surface of the LED chip 3 and connected to the wire-bonding portico 22 with a wire 61. The support member 4 includes a protective portion 42 covering a thickness-side surface of the first lead 1 with the mount surface 12a exposed. The die-bonding portion 12 bulges, in the thickness direction, relative to portions of the first lead 1 covered by the protective portion 42. The arrangements provide a longer lifetime and ensures reliability and proper light emission.
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