发明名称 HEAT DISSIPATION DEVICE
摘要 A heat dissipation device includes a housing, a fan mounted within the housing, a fin assembly fixed to the housing and heat pipes attached on the fin assembly. The housing includes a panel and a sidewall extending upwardly from a periphery of the panel. The fin assembly includes first fins and second fins alternately arranged on the panel. The first fins and the second fins each include a plate, an upper flange and a lower flange extending from a top side and a bottom side of the plate, respectively. Each second fin defines a slot in a lateral side of the plate thereof adjacent to the fan. Every two adjacent first fin and second fin define a channel therebetween. Two adjacent channels communicate with each other at inlets thereof via the slot, and separated from each other at outlets thereof via a second fin.
申请公布号 US2013048255(A1) 申请公布日期 2013.02.28
申请号 US201113220722 申请日期 2011.08.30
申请人 XIA BEN-FAN;WANG ZHEN-YU;FOXCONN TECHNOLOGY CO., LTD.;FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD. 发明人 XIA BEN-FAN;WANG ZHEN-YU
分类号 F28F13/00 主分类号 F28F13/00
代理机构 代理人
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