PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERN HARDENING FILM USING PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can acquire performance in which physical properties of a film after hardening is not inferior to physical properties of a film hardened at high temperature, and to provide a method for manufacturing a pattern hardening film using the resin composition and electronic components.

SOLUTION: A resin composition contains: (a) a polybenzoxazole precursor having a repeating unit represented by general formula (I) (in the formula, U or V denotes a divalent organic group and at least one of U or V is a group including a 1-30C aliphatic chain structure); (b) a photosensitive agent; (c) a solvent; and (e) a dissolution inhibitor. The resin composition is used as a photosensitive resin composition of the above problem.

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