发明名称 |
WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF |
摘要 |
A wiring structure includes: an insulating film formed over a substrate; a plurality of wirings formed on the insulating film; and an inducing layer, which is formed on the insulating film in a region between the plurality of wirings, a constituent atoms of the wirings are diffused in the inducing layer.
|
申请公布号 |
US2013048358(A1) |
申请公布日期 |
2013.02.28 |
申请号 |
US201213530815 |
申请日期 |
2012.06.22 |
申请人 |
KANKI TSUYOSHI;SUDA SHOICHI;NAKATA YOSHIHIRO;FUJITSU LIMITED |
发明人 |
KANKI TSUYOSHI;SUDA SHOICHI;NAKATA YOSHIHIRO |
分类号 |
H05K1/00;H05K1/02;H05K3/00 |
主分类号 |
H05K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|