发明名称 RADAR PACKAGE FOR MILLIMETER WAVES
摘要 The present invention relates to a radar package for millimeter waves. A small-size, low-cost, light-weight, and high-precision radar sensor can be embodied by packaging an antenna, transceiver chips, and a digital signal processing chip into a radar-on chip through TSVs in order to reduce the size and integrate the antenna, the transceiver chips, and the digital signal processing chip into one package. Accordingly, a radar sensor for ultra-high precision, applicable to a radar for vehicles, an imaging system for weapon monitoring, and a radar for small-sized, light-weight, and precision measurement, all of which have a millimeter band, and to the autonomous traveling of a robot, can be embodied.
申请公布号 US2013050016(A1) 申请公布日期 2013.02.28
申请号 US201213594173 申请日期 2012.08.24
申请人 KIM CHEON SOO;YU HYUN KYU;ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 KIM CHEON SOO;YU HYUN KYU
分类号 G01S13/00 主分类号 G01S13/00
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