发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME
摘要 There are provided a multilayer ceramic electronic component, and a method of fabricating the same. The multilayer ceramic electronic component includes: a ceramic main body including a dielectric layer; first and second internal electrodes disposed to face each other within the ceramic main body; and a first external electrode and a second external electrode, wherein the first and second external electrodes include a conductive metal and glass, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of the glass in a central part thereof is 35% to 80% of the total area of the central part. A multilayer ceramic electronic component having improved reliability may be implemented by enhancing chip air-tightness.
申请公布号 US2013050896(A1) 申请公布日期 2013.02.28
申请号 US201213569738 申请日期 2012.08.08
申请人 PARK MYUNG JUN;KWON SANG HOON;PARK JAE YOUNG;LEE KYU HA;JEON BYUNG JUN;CHOI DA YOUNG;GU HYUN HEE;KIM CHANG HOON;SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK MYUNG JUN;KWON SANG HOON;PARK JAE YOUNG;LEE KYU HA;JEON BYUNG JUN;CHOI DA YOUNG;GU HYUN HEE;KIM CHANG HOON
分类号 H01G4/12 主分类号 H01G4/12
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