ELECTRONIC BOARD AND ELECTRONIC DEVICE

摘要

An electronic board (100D) has a board-shaped substrate (110) that enables a heat-generating element (120) to be mounted, and has a cooling structure that cools the heat-generating element (120). The electronic board (100) can be inserted in/removed from a casing (200) along an axis roughly parallel to the substrate (110) plane. The cooling structure is provided on the board-shaped substrate (110), and has a hollow first heat-radiating section (160D) and a heat-transmitting section (700). The hollow first heat-radiating section (160D) radiates the generated heat of the heat-generating element (120) mounted on the substrate (110). The heat-transmitting section (700) transmits the generated heat of the heat-generating element (120) to the first heat-radiating section (160D). The first heat-radiating section (160D) has a first joining surface (165) formed in alignment with a plane roughly perpendicular to the insertion/removal axis (W) of the substrate (110). The first heat-radiating section (160D) is thermally connected to a second heat-radiating section (260B) provided on the casing (200), with the first joining surface (165) therebetween. This structure enables sufficient radiation of the generated heat of the heat-generating element.