| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power module substrate, a power module substrate with a heat sink, a power module and a power module substrate manufacturing method, which can radiate heat from an electronic component and the like mounted on a circuit layer and inhibit an occurrence of cracks in an insulation substrate under a cooling/heating cycle load. <P>SOLUTION: A power module substrate 10 comprises an insulation substrate 11 and a circuit layer 12 formed on one surface of the insulation substrate 11. The circuit layer 12 is composed of a copper plate bonded to the one surface of the insulation substrate 11. The copper plate has a composition of containing, before being bonded, either one of at least one element of a total amount of not less than 1 molppm to not more than 100 molppm among an alkaline earth element, a transition metal element and a rare earth element, or boron of not less than 100 molppm to not more than 1000 molppm, in which the balance is copper and incidental impurities. <P>COPYRIGHT: (C)2013,JPO&INPIT |
