| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin material which can give a low linear thermal expansion coefficient in cured product and also small surface roughness to the surface of a cured product which is subjected to roughening process, and can improve adhesion between a cured product and a metal layer. <P>SOLUTION: The epoxy resin material includes an epoxy resin, a cyanate ester resin, the first inorganic filler, the second inorganic filler, a thermoplastic resin, and a curing accelerator. The average particle diameter of the first inorganic filler is smaller than the average particle diameter of the second inorganic filler. The epoxy resin material contains the first inorganic filler and the second inorganic filler in a weight ratio of 5:95-90:10. A multilayer board 11 is provided with a circuit board 12 and cured material layers 13-16 arranged on the surface 12a on which the circuit of circuit board 12 is formed. The cured material layers 13-16 are formed by curing the epoxy resin material. <P>COPYRIGHT: (C)2013,JPO&INPIT |
