| 摘要 |
A stackable semiconductor package, a stacked semiconductor package that uses the stackable semiconductor packages, and a method of fabricating the same. The semiconductor package includes a die paddle unit having a first surface and a second surface opposite to the first surface, a semiconductor die attached to the first surface of the die paddle unit, a plurality of leads each including a first external terminal unit, a second external terminal unit, and a connection lead unit that connects the first external terminal unit to the second external terminal unit, a bonding wire that connects the semiconductor die to the first external terminal unit, and a sealing member formed to expose the first external terminal unit and the second external terminal unit and to surround the semiconductor die and the bonding wire. |
