发明名称 FRICTION STIR WELDED STRUCTURE AND POWER SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To reduce the deformation of members to be welded caused by frictional heat which is generated in friction stir welding and load from a tool. <P>SOLUTION: A butt part W1 where the member 10 to be welded is superposed on the member 20 to be welded, is welded by friction stir welding. A thin walled part 12 is provided in the vicinity of the friction stir welding part FSW1. By the thin walled part 12, the transfer 12 of the frictional heat generated upon friction stir welding and the load from a welding tool to the whole member 10 to be welded is suppressed and the amount of generation of deformation on the member 10 to be welded is reduced. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013039615(A) 申请公布日期 2013.02.28
申请号 JP20110179706 申请日期 2011.08.19
申请人 HITACHI AUTOMOTIVE SYSTEMS LTD 发明人 HORI TOSHIO;URASHIRO KEIICHI;HIGUMA MASATO;KANEKO YUJIRO;HIRANO SATOSHI;SATO AKIHIRO
分类号 B23K20/12;H01L23/473 主分类号 B23K20/12
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