| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve improvement in quality of a non-lead type semiconductor device. <P>SOLUTION: A semiconductor device comprises: an encapsulation body resin sealing a semiconductor chip 2; a tab 1b arranged inside the encapsulation body; suspension leads 1e supporting the tab 1b; a plurality of leads each having a connection target surface exposed on a rear face of the encapsulation body at a peripheral edge; and a plurality of wires connecting pads of the semiconductor chip and the leads, respectively. Ends of the suspension leads 1e are arranged at a periphery of the encapsulation body, not exposed on the rear face of the encapsulation body, and covered by the encapsulation body. Accordingly, because a standoff of each suspension lead 1e is not formed by resin mold, each corner of the rear face of the encapsulation body can be supported, at the time of cutting the suspension leads, by a flat part of a backup part of a cutting die, the flat part having a sufficiently wider area than a cutting margin for the suspension lead 1e. As a result, an occurrence of resin cracking can be prevented and improvement of a quality of QFN (semiconductor device) can be achieved. <P>COPYRIGHT: (C)2013,JPO&INPIT |
