发明名称 |
BALL GRID ARRAY FORMED ON PRINTED CIRCUIT BOARD |
摘要 |
A ball grid array formed on a printed circuit board is provided. The ball grid array includes a first bailout module and a second bailout module. The first bailout module includes a plurality of first solder balls arranged as an array. Two of the first solder balls are grounded, and remaining of the first solder balls are disposed within a shielding area defined by the two grounded first balls. Two among the second solder balls are grounded, and remaining of the second solder balls are disposed within a shielding area of the two grounded second balls. The first and second bailout modules deploy substantially a same bailout arrangement, which is associated with relative positions of the two grounded solder balls and the remaining solder balls that are not grounded in each bailout module.
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申请公布号 |
US2013048364(A1) |
申请公布日期 |
2013.02.28 |
申请号 |
US201213590590 |
申请日期 |
2012.08.21 |
申请人 |
SHIU JIAN-FENG;TYAN EER-WEN;WANG TING-KUANG;MSTAR SEMICONDUCTOR, INC. |
发明人 |
SHIU JIAN-FENG;TYAN EER-WEN;WANG TING-KUANG |
分类号 |
H05K1/11;H05K3/10 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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