METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD

摘要

The present invention discloses a method of manufacturing a multilayer PCB including: a panel preparation step of preparing a working panel on which a plurality of PCB units having a plurality of inner layer circuit pattern portions are arrayed; a defective portion removing step of removing a defective inner layer circuit pattern portion among the plurality of inner layer circuit pattern portions; a good portion providing step of providing a good inner layer circuit pattern portion in a portion of the working panel, from which the defective inner layer circuit pattern portion is removed; and an outer layer forming step of forming an outer layer circuit pattern portion in the PCB unit. The present invention is capable of improving productivity and reducing manufacturing costs by preventing product loss due to disposal of the PCB unit having the defective inner layer circuit pattern portion.