发明名称 |
SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE |
摘要 |
A semiconductor device including a semiconductor substrate and a conductive post overlying and electrically connected to the substrate. The semiconductor device further includes a manganese-containing protection layer on a surface of the conductive post. A method of forming a semiconductor device. The method includes forming a bond pad region on a semiconductor substrate. The method further includes forming a conductive post overlying and electrically connected to the bond pad region. The method further includes forming a protection layer on a surface of the conductive post, wherein the protection layer comprises manganese (Mn).
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申请公布号 |
US2013049194(A1) |
申请公布日期 |
2013.02.28 |
申请号 |
US201213660348 |
申请日期 |
2012.10.25 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIU CHUNG-SHI;YU CHEN-HUA |
分类号 |
H01L23/498;H01L21/768 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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