发明名称 |
Screening Process for Manufacturing a Z-directed Component for a Printed Circuit Board |
摘要 |
A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes adding a substrate material to a mold defining the shape of a layer of the z-directed component. A top surface of the substrate material in the mold is leveled. The substrate material in the mold is treated and the layer of the z-directed component is formed. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed that includes a stack of component layers that includes the formed layer. |
申请公布号 |
US2013052338(A1) |
申请公布日期 |
2013.02.28 |
申请号 |
US201113222418 |
申请日期 |
2011.08.31 |
申请人 |
HALL PAUL KEVIN;HARDIN KEITH BRYAN;KRATZER ZACHARY CHARLES NATHAN;ZHANG QING |
发明人 |
HALL PAUL KEVIN;HARDIN KEITH BRYAN;KRATZER ZACHARY CHARLES NATHAN;ZHANG QING |
分类号 |
B05D5/12 |
主分类号 |
B05D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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