| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a grinding method for a plate-like object, which can reduce the risk of damaging the plate-like object, when peeling the plate-like object such as a wafer from a support member. <P>SOLUTION: The grinding method for a plate-like object, which grinds the rear face of the plate-like object arranged on the support member and thins the plate-like object to have a predetermined thickness comprises the steps of: forming a peeling starting part which is closely attached on the support member larger in area than the plate-like object so as to be peelable; placing the front surface side of the plate-like object on the peeling starting part, embedding the front surface side of the plate-like object with an ultraviolet curing resin, and surrounding an outer circumferential surface of the plate-like object by the ultraviolet curing resin; subsequently, irradiating the ultraviolet curing resin with ultraviolet rays so as to fix the plate-like object on the support member through the peeling starting part and the ultraviolet curing resin in a state of exposing the rear face thereof; subsequently, grinding the rear face of the plate-like object while holding the support member by a chuck table and thinning the plate-like object to have a predetermined thickness; and peeling the support member from a plate-like object unit at a boundary face of the peeling starting part and the support member. <P>COPYRIGHT: (C)2013,JPO&INPIT |
