发明名称 |
Die Press Process for Manufacturing a Z-directed Component for a Printed Circuit Board |
摘要 |
A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes punching a plurality of segments out of at least one sheet of substrate material to form a plurality of layers of the Z-directed component. A channel is formed through the substrate material either before or after the segments are punched. At least one of the formed layers includes at least a portion of the channel. A conductive material is applied to at least one surface of at least one of the formed layers. A stack of the formed layers is combined to form the Z-directed component.
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申请公布号 |
US2013048199(A1) |
申请公布日期 |
2013.02.28 |
申请号 |
US201113222748 |
申请日期 |
2011.08.31 |
申请人 |
HALL PAUL KEVIN;HARDIN KEITH BRYAN;KRATZER ZACHARY CHARLES NATHAN;ZHANG QING |
发明人 |
HALL PAUL KEVIN;HARDIN KEITH BRYAN;KRATZER ZACHARY CHARLES NATHAN;ZHANG QING |
分类号 |
B32B38/18 |
主分类号 |
B32B38/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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