发明名称 |
QFN DEVICE AND LEAD FRAME THEREFOR |
摘要 |
A lead frame for a quad flat no-lead (QFN) type semiconductor device package includes a die pad, a plurality of leads that surround the die pad. The outer edge of leads includes a channel that extends from a lower surface to an upper surface of the leads. A semiconductor die is attached to the die pad. An inner edge of each lead is electrically connected to a corresponding bonding pad on the semiconductor die. The assembly is covered with an encapsulation material except that the outer edge of each lead and the corresponding channel are exposed. The channel allows solder to flow up the outer edge of a lead when the QFN device is soldered to a substrate, which improves the ability to perform visual inspection of the solder-lead connection.
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申请公布号 |
US2013049180(A1) |
申请公布日期 |
2013.02.28 |
申请号 |
US201213549517 |
申请日期 |
2012.07.15 |
申请人 |
XU NAN;PANG XINGSHOU;TIAN BIN;ZHAO SHUFENG;FREESCALE SEMICONDUCTOR, INC |
发明人 |
XU NAN;PANG XINGSHOU;TIAN BIN;ZHAO SHUFENG |
分类号 |
H01L23/495;H01L21/60 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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