发明名称 |
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS |
摘要 |
Discontinuous bonds for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a first substrate and a second substrate, with at least one of the first substrate and the second substrate having a plurality of solid-state transducers. The second substrate can include a plurality of projections and a plurality of intermediate regions and can be bonded to the first substrate with a discontinuous bond. Individual solid-state transducers can be disposed at least partially within corresponding intermediate regions and the discontinuous bond can include bonding material bonding the individual solid-state transducers to blind ends of corresponding intermediate regions. Associated methods and systems of discontinuous bonds for semiconductor devices are disclosed herein.
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申请公布号 |
US2013049016(A1) |
申请公布日期 |
2013.02.28 |
申请号 |
US201113220462 |
申请日期 |
2011.08.29 |
申请人 |
SCHELLHAMMER SCOTT D.;ODNOBLYUDOV VLADIMIR;FREI JEREMY S.;MICRON TECHNOLOGY, INC. |
发明人 |
SCHELLHAMMER SCOTT D.;ODNOBLYUDOV VLADIMIR;FREI JEREMY S. |
分类号 |
H01L27/142;H01L31/18;H01L33/08 |
主分类号 |
H01L27/142 |
代理机构 |
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主权项 |
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地址 |
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