IMPEDANCE MATCHING APPARATUS

摘要

The present invention discloses an impedance matching apparatus. The impedance matching apparatus includes: a multilayer printed circuit board; a signal line including a plurality of signal layers with the same pitch and formed by sequentially arranging the plurality of signal layers on the multilayer printed circuit board; and a ground plane including a plurality of ground layers formed inside the multilayer printed circuit board, wherein the plurality of ground layers are arranged to get closer to a bottom surface of the multilayer printed circuit board from a region corresponding to one side of the signal line to a region corresponding to the other side of the signal line to adjust an impedance value.