| 摘要 |
A method for inspection of flat objects, particularly wafers, with the steps: recording a digital image of the object surface with a detector with a plurality of image elements; detecting defects on the object surface, is characterized by the steps: combining defective image points into groups; filtering the groups generated in this way, wherein groups not reaching a minimum size and for which no further defective image points are present within a minimal spacing are discarded; repeating the grouping and filtering steps, wherein the minimum size of the group is replaced in each repetition by a size that is larger than the minimum size and/or the minimum spacing is replaced in each repetition by a spacing that is larger than the minimum spacing until a maximum size and/or a maximum spacing is reached. |
