发明名称 APPARATUS FOR FORMING MULTI COATING LAYER ON SUBSTRATE
摘要 PURPOSE: A linear deposition device for multilayer thin films is provided to induce a first and a second electric beam to a first and second crucible which are formed with pockets in which mutually different material sources are accommodated so that the various materials of source molecules are evaporated, thereby depositing several to dozens of thin films to be multilayered on a substrate. CONSTITUTION: A deposition device for linear multilayer thin films includes a deposition chamber(C3) which includes a deposition space(C3-1), a first buffer space(C3-2), and a second buffer space(C3-3). The first buffer space(C3-2) and the second buffer space(C3-3) are formed to be stepped on the upper side of the deposition space for spatially being separated from the deposition space. The deposition space has a stepped depth based on the surfaces of the first and second buffer space, and has a bottom supporting plane(C3-1') at which first and second deposition parts(40,50) are installed. The deposition space forms a spreading space, in which source molecules evaporated from first and second crucibles(42,52) spread to the entire surface of a substrate(S) since a distance of separation between the first and second crucibles and the substrate is 500 to 1000 millimeters. A shield(60) is included inside the deposition space to separate he first and second deposition parts.
申请公布号 KR101238534(B1) 申请公布日期 2013.02.28
申请号 KR20120067205 申请日期 2012.06.22
申请人 KWN, OH EICK 发明人 KWN, OH EICK
分类号 C23C14/56;C23C14/34 主分类号 C23C14/56
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