POWER OVERLAY STRUCTURE WITH LEADFRAME CONNECTIONS

摘要

PROBLEM TO BE SOLVED: To provide a power overlay (POL) packaging structure that incorporates a leadframe connection.

SOLUTION: A POL structure 10 includes a POL sub-module 14 having: a dielectric layer; at least one semiconductor device 12 attached to the dielectric layer and including a substrate composed of a semiconductor material and a plurality of connection pads formed on the substrate; and a metal interconnect structure electrically coupled to the plurality of connection pads of the at least one semiconductor device 12. The metal interconnect structure extends through vias formed through the dielectric layer so as to be connected to the plurality of connection pads. The POL structure 10 also includes a leadframe 26 electrically coupled to the POL sub-module 14, the leadframe 26 comprising leads 28 configured to make an interconnection to an external circuit structure.

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