发明名称 SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device including a semiconductor element having excellent characteristics. <P>SOLUTION: A method of manufacturing a semiconductor device comprises: a step of forming a first conductive layer functioning as a gate electrode on a substrate; a step of forming a first insulating layer so as to cover the first conductive layer; a step of forming a semiconductor layer on the first insulating layer so that a part thereof overlaps the first conductive layer; a step of forming a second conductive layer so as to be electrically connected to the semiconductor layer; a step of forming a second insulating layer covering the semiconductor layer and the second conductive layer; a step of forming a third conductive layer electrically connected to the second conductive layer; a first heat treatment step before the step of forming the second insulating layer, after the step of forming the semiconductor layer; and a second heat treatment step after the step of forming the second insulating layer. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013042150(A) 申请公布日期 2013.02.28
申请号 JP20120206923 申请日期 2012.09.20
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 OHARA HIROKI;SASAKI TOSHINARI
分类号 H01L29/786;G02F1/1368;G02F1/167;G02F1/17;H01L51/50;H05B33/04;H05B33/22 主分类号 H01L29/786
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