发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device including a semiconductor element having excellent characteristics. <P>SOLUTION: A method of manufacturing a semiconductor device comprises: a step of forming a first conductive layer functioning as a gate electrode on a substrate; a step of forming a first insulating layer so as to cover the first conductive layer; a step of forming a semiconductor layer on the first insulating layer so that a part thereof overlaps the first conductive layer; a step of forming a second conductive layer so as to be electrically connected to the semiconductor layer; a step of forming a second insulating layer covering the semiconductor layer and the second conductive layer; a step of forming a third conductive layer electrically connected to the second conductive layer; a first heat treatment step before the step of forming the second insulating layer, after the step of forming the semiconductor layer; and a second heat treatment step after the step of forming the second insulating layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013042150(A) |
申请公布日期 |
2013.02.28 |
申请号 |
JP20120206923 |
申请日期 |
2012.09.20 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
OHARA HIROKI;SASAKI TOSHINARI |
分类号 |
H01L29/786;G02F1/1368;G02F1/167;G02F1/17;H01L51/50;H05B33/04;H05B33/22 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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