发明名称 MANUFACTURING METHOD OF INSULATION CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an insulation circuit board which has excellent electric insulation properties. <P>SOLUTION: In an insulation circuit board 4, a circuit board 6 made of a conductive material is brazed on one surface of an electric insulation plate 5, and a surface located on the opposite side of the surface of the circuit board 6 serves as a wiring surface 9 having an electronic element mounting part 11, the surface of the circuit board being brazed to the electric insulation plate 5. Further, the electric insulation plate 5 is larger than the circuit board 6 and a contour of the electric insulation plate 5 is positioned at the outer side relative to a contour of the circuit board 6. In a manufacturing method of the insulation circuit board 4, a melted brazing material intrusion prevention object which prevents the melted brazing material from intruding into the wiring surface 9 is adhered to the wiring surface 9 of the circuit board 6. The circuit board 6 is laminated on the electric insulation plate 5 so that a brazing material layer exist between the electric insulation plate 5 and the circuit board 6, and the electric insulation plate 5, the circuit board 6, and the brazing material layer are heated in the state. The electric insulation plate 5 and the circuit board 6 are brazed to each other with the brazing material melted from the brazing material layer. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013042055(A) 申请公布日期 2013.02.28
申请号 JP20110179360 申请日期 2011.08.19
申请人 SHOWA DENKO KK 发明人 SUZUKI DAISUKE
分类号 H05K3/38;B23K1/00;B23K1/19;H01L23/36 主分类号 H05K3/38
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