| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cutting method of an aggregate substrate of package members for a piezoelectric vibration device capable of minimizing generation of chipping. <P>SOLUTION: In a cutting method for splitting an aggregate substrate 100, in which a plurality of package members for piezoelectric vibration device produced by sealing the excitation electrodes formed in a piezoelectric element are formed, into the package members, a plurality of split grooves 5 for splitting the package members are formed in one principal surface 101 of the aggregate substrate 100. The split groove 5 has a ramp 50 the width of which decreases gradually from the one principal surface 101 in the thickness direction of the aggregate substrate 100, and the aggregate substrate 100 is cut from a partial region of the ramp 50 by means of a dicing blade B. <P>COPYRIGHT: (C)2013,JPO&INPIT |
