| 摘要 |
<p>This semiconductor device is provided with: first and second semiconductor chips mounted on a base body; a third semiconductor chip, which is mounted on the base body, and outputs control signals that control operations of the first and the second semiconductor chips; a first transmitting transformer, which is mounted on the base body, has a receiving-side terminal connected to the third semiconductor chip, and a transmitting-side terminal connected to the first semiconductor chip; and a second transmitting transformer, which is mounted on the base body, has a receiving-side terminal connected to the third semiconductor chip, and a transmitting-side terminal connected to the second semiconductor chip. The control signals are transmitted from the third semiconductor chip to the first semiconductor chip and the second semiconductor chip via the first transmitting transformer and the second transmitting transformer, respectively.</p> |
