| 摘要 |
<p>Cooling device for cooling a molten solder (23) of at least one large solder connection to be produced, comprises an evacuable chamber (1), a holder (2) arranged in the evacuable chamber, and a heat sink unit arranged in the evacuable chamber, where the heat sink unit is controlled such that a flat copper plate (5) is accurately inserted in the holder including a planar lower main surface (5b), a planar upper main surface, and two rectangular surface portions lying next to each other. Cooling device for cooling a molten solder (23) of at least one large solder connection to be produced, comprises an evacuable chamber (1), a holder (2) arranged in the evacuable chamber, and a heat sink unit arranged in the evacuable chamber, where the heat sink unit is controlled such that a flat copper plate (5) is accurately inserted in the holder, which includes (i) a planar lower main surface (5b), (ii) a planar upper main surface, which is spaced in a vertical direction from the lower main surface, and (iii) the two rectangular surface portions lying next to each other, where the number (N) is >= 2, each exhibiting an area of at least 30x 30 mm, a constant thickness of 5 mm, and a homogeneous initial temperature of at least 220[deg] C. The holder is cooled under a nitrogen atmosphere at a pressure of 1013.25 hPa in the evacuation chamber, such that the temperature at the upper main surface exhibits a local maximum in any of the surface portions, and is spaced apart from the edge of the respective surface portions until a minimum distance cooling temperature (at least 200[deg] C) is achieved in any of the surface portions. An independent claim is also included for a soldering system comprising an integrated cooling system.</p> |
