| 摘要 |
<p>OF THE DISCLOSUREThe present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (D): (A) an epoxy resin; (B) aphenol resin; (C) an inorganic filler; and (D) a silicone compound containing an alkoxy group directly bonded to silicon atom in an amount of 10 to 45 wt% based on the entire silicone compound and having a specific gravity of 1.10 to 130. FIGURE 1</p> |
