| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem that a substrate holder and components included in the substrate holder are deteriorated due to dust adhering to the substrate holder and heat, pressure, and the like which are applied to the substrate holder in a bonding apparatus. <P>SOLUTION: A management device of a substrate holder holding a substrate includes: a recording part recording at least one of multiple processes where the substrate holder is used; and a change part changing at least any condition of the multiple processes on the basis of records of the multiple processes which are recorded in the recording part. The change part may change the use condition of the substrate holder or change the process condition for the substrate as the condition. <P>COPYRIGHT: (C)2013,JPO&INPIT |
