发明名称 COPPER-BASED SLIDING MATERIAL
摘要 In a copper-based sliding material in which a Cu alloy layer contains 5% to 30% by mass of Bi, and the balance consisting of Cu and an unavoidable impurity, Bi is dispersed as particles of a Bi phase in the Cu alloy layer, and the mass ratio of the particles having a particle size of 2 to 50μm and a circularity of 0.1 to 0.7 is 30% or more in the entire Bi phase in the Cu alloy layer, so that the particles of the Bi phase are uniformly dispersed in the Cu alloy layer. Therefore, the particles of the Bi phase in the Cu alloy layer are sequentially exposed to a sliding surface as wear of the sliding material progresses while excessive flow-out of molten Bi is prevented, so that improved seizure resistance is achieved.
申请公布号 US2013052473(A1) 申请公布日期 2013.02.28
申请号 US201213572915 申请日期 2012.08.13
申请人 SATO RYO;IMAI TAKUO;TUJIMOTO KENTARO;DAIDO METAL COMPANY LTD. 发明人 SATO RYO;IMAI TAKUO;TUJIMOTO KENTARO
分类号 B32B15/01;B32B5/16;B32B15/20;F16C33/12 主分类号 B32B15/01
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