发明名称 |
BOND PAD MONITORING STRUCTURE AND RELATED METHOD OF DETECTING SIGNIFICANT ALTERATIONS |
摘要 |
A passive bond pad condition sense structure may be configured to be electrically stimulated and tested for detecting an anomalous or altered electrical characteristic caused by stress or aging of the bond pad capacitively coupled to it. The related bond pad condition testing or monitoring system may include relatively simple stimulating and sensing circuits that may be wholly embedded in the integrated circuit device.
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申请公布号 |
US2013048982(A1) |
申请公布日期 |
2013.02.28 |
申请号 |
US201213599271 |
申请日期 |
2012.08.30 |
申请人 |
PATTI DAVIDE GIUSEPPE;LAROSA MANUELA;STMICROELECTRONICS S.R.I. |
发明人 |
PATTI DAVIDE GIUSEPPE;LAROSA MANUELA |
分类号 |
H01L23/544;H01L21/28;H01L23/48 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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